| 摘要 |
PURPOSE:To enhance the density and to reduce the size of a substrate without reducing its moisture resistance by forming a recess for placing an electronic component on a substrate made of a plastic material, and forming a water repelling resin layer in the lower part of the bottom of the recess in the substrate. CONSTITUTION:A recess 4 for placing an electronic component is formed on a substrate 2 made of a plastic material, and a water repelling resin layer 5 is formed in the lower part of the bottom of the recess 4 in the substrate 2. For example, the recess 4 is formed by spot facing on an upper substrate 2a with one side copper foil made of heat resistant glass epoxy resin, a water repelling resin layer 5 made of Teflon treated with metallic sodium and a lower substrate 2b with one side copper foil made of heat resistant glass epoxy resin are bonded through an intermediate substrate 2c made of epoxy resin on the upper substrate 2a, a conductor circuit 7 is formed by a predetermined method, and a substrate 1 for placing an electronic component as shown in the drawing is obtained. |
