| 摘要 |
A printed circuit board comprises an insulator film extending over the front surface of a substrate. The insulator film is designed to bend around the outer periphery of the substrate so as to reach the back surface of the substrate. A wiring pattern is printed on the surface of the insulator film so as to extend over the front and back surfaces of the substrate. The wiring pattern serves to electrically connect the opposite surfaces, namely, the front and back surfaces of the printed circuit board without a conductive through hole or via. Even if input/output pins of the semiconductor chip are increased, it is possible to avoid a deteriorated efficiency and an increased cost in production. |
