| 摘要 |
PURPOSE:To reduce line widths necessary for connection, spaces between lines necessary for insulation and so forth by a method wherein spaces between a pellet and wirings are filled with insulating layers and connecting conductors which connect the electrodes of the pellet to the wirings are selectively formed on the insulating layers. CONSTITUTION:A lead frame 2 has a tab 4 with tab suspending leads 3, a plurality of inner leads 5 provided around the tab 4 and outer leads 6. A pellet 8 in which an integrated circuit is formed is bonded to the tab 4 with a die- bonding part 7 in between. Electrodes 9 are exposed on the top surface of the pellet 8 by removing a protective film 10 selectively. The electrodes 9 are electrically connected to the inner leads 5 by connecting conductors 12 formed on insulation layers 11. Therefore, compared with the conventional constitution wherein the connection is made by bonding wires, spaces between the connecting conductors 12 and 12 corresponding to the insulation gaps and the line widths of the connecting conductors 12 corresponding to the bonding wire diameters can be significantly reduced. |
