发明名称 WAFER HOUSING JIG
摘要 PURPOSE:To prevent the damage on wafers while conveyed by a method wherein a wafer press-plate of elastic structure is attached to the frame body in which the wafer is housed, and the clatter of the wafer in a housing jig can be removed. CONSTITUTION:A frame body 3 is constructed by connecting a plurality of cylindrical quartz members using a means such as welding and the like. The part surrounded by the frame body 3 forms the housing space A wafers 2, and the wafer 2 is inserted into the wafer supporting groove 6 bored on the side of the space of the quartz member. An inserting groove 7 is formed on both outside parts in the longitudinal direction of the frame body 3, and the tip of the arm 5a of a handle 5 is inserted into the groove 7. A press-plate 4 consisting of fluororesin is attached to the part located in the middle of the arm 5a, and a wafer 2 is fixed in the wafer supporting groove 6 by the elasticity of the press-plate 4. As a result, the wafers are prevented from being clattered, and the damage generating while the wafers are conveyed can also be prevented.
申请公布号 JPS6345830(A) 申请公布日期 1988.02.26
申请号 JP19860188459 申请日期 1986.08.13
申请人 HITACHI TOKYO ELECTRON CO LTD;HITACHI LTD 发明人 SASAKI AKIRA;SAKURAI TOSHIHIKO
分类号 B65D85/86;B65D85/38;H01L21/673;H01L21/68 主分类号 B65D85/86
代理机构 代理人
主权项
地址