METHOD OF MAKING HIGH DENSITY INTERCONNECTION SUBSTRATES USING STACKED MODULES AND SUBSTRATES OBTAINED

摘要

In order to provide for interconnection of a plurality of electronic components, thin sheets (20, 21) of an appropriate dielectric material have holes (22) drilled therethrough. The holes (22) are then filled with a conducting material (23) and the surfaces of the substrates (24) are lapped to insure smoothness. A conducting pattern (25, 26) (i.e. of conducting traces) is formed on the surfaces of the dielectric sheets. Conducting regions are also formed on the dielectric sheet surfaces. A first sheet (21) of dielectric material has conducting dots (27) applied to the conducting regions on a first surface. A second sheet (20) of dielectric material is aligned with the first sheet so that conducting regions of a second surface of the second dielectric sheet (20) can be coupled to the conducting dots (27). The structure is processed so that the conducting dots (27) cause the two dielectric sheets (20, 21) to be joined both physically and electrically at the conducting regions. By appropriate arrangement of the conducting regions, conducting traces (26) on adjacent surfaces of adjoining dielectric sheets (20, 21) and conducting traces (26) on opposite surfaces of a dielectric sheet (20, 21) can be coupled to provided appropriate interconnection of electronic components.