| 摘要 |
The invention relates to a method of producing microelectronic circuits, which includes a step of metallising a substrate 2 by depositing a thick layer 1 obtained by screen printing and which next includes a step of selective cutting by photoetching of the thus metallised layer. Application to microelectronic circuits especially to hybrid analogue circuits and to microstrip and coplanar ultra-high-frequency circuits. <IMAGE>
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