发明名称 |
THERMAL CONDUCTION STRUCTURE FOR SEMICONDUCTOR PACKAGES |
摘要 |
<p>An improved conduction cooling system for a semiconductor package that includes a slidable conduction cooling piston in contact with a device and mounted in a cap or cold plate, a means for urging the piston longitudinally and laterally into contact with the device and the cap or cold plate, respectively, and a means to prevent rotation of the piston.</p> |
申请公布号 |
DE3278000(D1) |
申请公布日期 |
1988.02.18 |
申请号 |
DE19823278000 |
申请日期 |
1982.07.16 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MEAGHER, RALH ERNEST;OSTERGREN, CARL DAVID |
分类号 |
H01L23/40;H01L23/433;(IPC1-7):H01L23/42 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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