| 发明名称 |
SEMICONDUCTOR DEVICE COMPRISING A SEMICONDUCTOR SUBSTRATE BONDED TO A MOUNTING MEANS |
| 摘要 |
In bonding a semiconductor substrate onto a mounting means, a multiple layer metal electrode is formed on the surface, the multiple layer comprising at least a chromium-nickel alloy layer, nickel layer and a noble metal layer of a noble metal selected from a group consisting of gold, silver or platinum, which is bonded to a solder layer of Pb-Sn-alloy or Ag-Sb-Sn-alloy of the mounting means. |
| 申请公布号 |
DE3277953(D1) |
申请公布日期 |
1988.02.11 |
| 申请号 |
DE19823277953 |
申请日期 |
1982.07.01 |
| 申请人 |
MATSUSHITA ELECTRONICS CORPORATION |
发明人 |
HATTORI, HIROTSUGU;KUWAGATA, MASAHIRO |
| 分类号 |
H01L21/52;H01L21/58;H01L21/60;H01L23/492;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/52 |
| 代理机构 |
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