发明名称 |
Multi-layer circuit board having a large heat dissipation |
摘要 |
A multi-layer circuit board is disclosed which includes a plurality of AlN ceramic layers stocked and combined as an integrated form and wiring layers interposed at different levels between the AlN ceramic layers. The wiring layers are made of a mixture of tungsten and AlN ceramic particles, the content of the AlN ceramic particles being 0.5 to 2.0 wt. %. A plurality of through-holes are formed in the AlN ceramic layers to interconnect the wiring layers formed at different levels.
|
申请公布号 |
US4724283(A) |
申请公布日期 |
1988.02.09 |
申请号 |
US19860912537 |
申请日期 |
1986.09.29 |
申请人 |
NEC CORPORATION |
发明人 |
SHIMADA, YUZO;KUROKAWA, YASUHIRO;UTSUMI, KAZUAKI |
分类号 |
H05K3/46;H01L23/15;H01L23/538;H05K1/03;H05K1/09;(IPC1-7):H05K1/00 |
主分类号 |
H05K3/46 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|