| 摘要 |
A lithography system (1000) is provided with: a measuring device (100) which measures position information about a plurality of marks on a substrate held in a first stage; and an exposure device (200) which mounts, on a second stage, the substrate for which the position information measurement for the marks has been completed, performs alignment-measurement to measure position information for some marks selected from among the plurality of marks on the substrate, and performs exposure. The measuring device measures position information for many marks on the substrate to obtain higher-order components of correction amounts of an array of a plurality of partitioned regions, and the exposure device measures position information for a small number of marks on the substrate to obtain lower-order components of the correction amounts of the array of the plurality of partitioned regions and exposes the plurality of partitioned regions while controlling the position of the substrate by using the obtained lower-order components and the higher-order components obtained by the measuring device. |
