| 摘要 |
PURPOSE:To prevent short-circuit between neighboring bumps and to achieve miniaturization of the bumps, by forming a metal film only in a window, forming an insulating film so that the head part of the metal film is exposed, fusing the head part of the metal film, forming this part in a spherical shape, and forming the metallic bump. CONSTITUTION:Film resist 4 is exposed by using a mask 9, in which solderbump forming places are opened. The resist is developed, and an inverted taper shaped window 4a is formed at each solder-bump forming place. A solder film 5 is deposited on the film resist 4 and in the window 4a. The solder, which is deposited around the window 4a, is protruded on the window and form eaves. Therefore, a solder film 5a in the window 4a is formed in a tapered shape in the independent state from the other solder film 5. The head part of the solder film 5a is exposed on an interlayer insulating film 6. Only the head part is fused by heat treatment and a spherical shape is obtained. Thus a bump is formed. Even if the pitch between the neighboring bumps is small, short-circuit between them can be prevented. |
