发明名称 DEVICE FOR REGENERATING PLATING SOLUTION
摘要 PURPOSE:To efficiently remove both sulfate and formate ions accumulated in a chemical plating soln. by impressing a DC voltage respectively between a metallic mesh closely attached to an anion-exchange resin membrane provided between a cathode chamber and a plating soln. regeneration chamber and a cathode and between both anode and cathode. CONSTITUTION:An aq. NaOH soln. 11 is charged in the cathode chamber 50, the plating soln. 13 consisting of copper sulfate and sodium formate is fed into the regeneration chamber 60, and an aq. sulfuric acid soln. 12 is charged in an anode chamber 70. A specified voltage is impressed between the anode 2 and the cathode 1 from a DC power source E1. Besides, an appropriate voltage is impressed between the cathode 1 and the metallic mesh 4 from a DC power source E2 so that the potential of the metallic mesh 4 closely attached to the face of the resin membrane 40a on the chamber 60 side is set at an appropriate value with respect to a standard electrode 3, and the plating soln. 13 is regenerated. Consequently, the sulfate and formate ions in the plating soln. 13 are removed with approximately 100% current efficiency, and further the resin membrane 40a is not chemically plated with copper.
申请公布号 JPS6326378(A) 申请公布日期 1988.02.03
申请号 JP19860170517 申请日期 1986.07.18
申请人 KANTO GAKUIN;NEC CORP 发明人 HONMA HIDEO;KOBAYASHI KENJI;OTA HIROTOKU;KISHI MASAKATSU;SATO TAKAO
分类号 C23C18/40;C23C18/16 主分类号 C23C18/40
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