| 摘要 |
PURPOSE:To eliminate the need for the setting of a lower limit in the dimensions of a semiconductor pellet usable to the dimensions of an element loading section by forming an arcuate bent section to the nose of an external lead and forming a rectilinear shape hardly having excess length when completing a wiring process. CONSTITUTION:A lead frame contains an element loading section 1, on which a semiconductor pellet 1 is loaded, and an external lead 3 with a bent section 4, a nose of which is bent upward in an arcuate manner to the surface of the element loading section 1. The semiconductor pellet 2 is fixed to the element loading section 1, and an electrode for the semiconductor pellet 2 and the external lead 3 are connected by a metallic small-gage wire 5, pushing the external lead 3 by a crossarm 6. The metallic small-gage wire 5 is wired in the arcuate manner with excess length at that time. The external lead 3 is returned to an original shape by removing the crossarm 6, and the metallic small-gage wire 5 is formed to an approximately rectilinear shape hardly having excess length. Accordingly, even when the dimensions of the semiconductor pellet 2 are scaled down sufficiently to the element loading section 1, a contact with the element loading section 1 of the metallic small-gage wire 5 can be prevented when the pressure of a resin is applied in a resin seal process. |
