发明名称 |
SEMICONDUCTOR PACKAGE WITH HIGH DENSITY I/O LEAD CONNECTION |
摘要 |
Disclosed is a semiconductor package which permits coupling of semiconductor bond pads to I/O leads where a high density of connections is needed. Conductive fingers (16) backed by an insulating tape (17) are bonded to the ends of the fingers (11) on a lead frame (10). The tape fingers are electrically coupled to the bond pads (21) on one major surface of the semiconductor chip (20) by wire bonding. In one embodiment, the opposite major surface of the chip is bonded to a paddle (13) on the lead frame through an aperture (18) in the tape for maximum heat dissipation. |
申请公布号 |
EP0247775(A3) |
申请公布日期 |
1988.01.20 |
申请号 |
EP19870304417 |
申请日期 |
1987.05.19 |
申请人 |
AMERICAN TELEPHONE AND TELEGRAPH COMPANY |
发明人 |
GREENBERG, LAWRENCE ARNOLD;LANDO, DAVID JACOB |
分类号 |
H01L23/50;H01L23/28;H01L23/495;H01L23/498;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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