| 摘要 |
PURPOSE:To reduce the temperature rise of an integrated circuit element by mounting the integrated circuit element and a thermoelectric member having a Peltier effect characteristic in an integrated circuit device. CONSTITUTION:An integrated circuit element 3 is placed on the semiconductor element mounting stand 2 of a lead frame 1, and a thermoelectric cooling member 4 having a Peltier effect characteristic is also placed on the same stand 2. Since the member 4 is constructed as an element pair group in which an internal resistance is increased by electrically connecting many element pairs, since the cooling capacity of one thermoelectric cooling element pair cooling capacity is relatively small, and its cooling capacity is increased by a thermal parallel connection, and conductive metal electrodes 5 and the members 4 on the element 3 are wired by fine conductive metal wirings 6. Tab leads 7 for hanging the stand 2 and the members 4 are wired by fine metal wirings. After wiring, the element 3 and the member 4 are sealed with resin together with internal leads 9, the outer frame 1 of the lead frame and a tie bar 8 are cut separately, and electrically conducted by external leads 10. |
