| 摘要 |
PURPOSE:To avoid sagging of leads and protect bonding wires from damage by providing a thin strip bonded on the leads. CONSTITUTION:In this lead frame, a heat-resistant, insulating strip 5 of narrow (0.5-2.0 mm wide) polyimide surrounds an IC pellet 1 and is bonded to the tips of bonding leads 6 with a heat-resistant resin in such a manner that its outer edge overlaps them. Bonding wires pass over the strip. The heat resistant strip of polyimide film surrounds the IC pellet and is bonded to the tips of the bonding leads 6 with a heat-resistant resin which resists up to 350 deg.C. As a result, the leads 6 are supported by the strip and reinforced. Bonding wires are connected between pads and leads 6 over the strip 5. |
