发明名称 MOLDING MATERIAL FOR IC CARD
摘要 PURPOSE:To prevent filling particles from flocculating and precipitating so that molding materials become lower in viscosity and higher in fluidity, by hydrophobicly treating the surfaces of the filling particles by means of hydrophobic agents. CONSTITUTION:Surfaces of the filling particles are treated by means of hydrophobic agents. As raw materials for filling, molding materials for an IC card, particularly silica and alumina, are used in general. As hydrophobic agents, any materials which provide hydrophobic property to the surfaces of the filling particles, particularly silylated agents, silane coupling agents, etc., can be used. Thus, the filling particles can be prevented from flocculating and precipitating, so that the molding materials become lower in viscosity and higher in fluidity.
申请公布号 JPS636863(A) 申请公布日期 1988.01.12
申请号 JP19860150112 申请日期 1986.06.26
申请人 DAINIPPON PRINTING CO LTD 发明人 SUZUKI TOMOYUKI
分类号 B42D15/10;B42D15/02 主分类号 B42D15/10
代理机构 代理人
主权项
地址