SEMICONDUCTOR CHIP MOUNTING MODULE

摘要

A packaging and interconnection module for semiconductor chips comprises a ceramic base substrate (12, 13) for the chips (11, 11 min ) the substrate being provided with lead-out pins (15). Within the ceramic base substrate is a processing substrate (19) bearing insulating film layers carrying patterns of interconnection conductors with vias corresponding in position to the pins (15). One layer of the processing substrate constitutes a ground plane. The terminals of the chips (11, 11 min ) are connected to pads formed on the conductors of the upper layer of the processing substrate. Connections to the vias in the processing substrate may be made by solder bumps. …Generally two layers of interconnection conductors extending generally perpendicular to each other will be sufficient for interconnecting the chips. …This method allows thin film technology to be used for manufacturing the processing substrate. It permits close spacing of the chips with short conductive paths in a material of low dielectric constant.