Small test rods for film circuits

摘要

When locating faults in the production and for investigation and optimisation in the development of thin film and thick film circuits, it is necessary to exchange individual components which was previously mainly done by soldering and unsoldering; apart from the risk of destroying the film circuits and/or the chips, this is a cumbersome way of working. According to the invention, it is proposed to attach to the end face of a rod-shaped insulating rod a corresponding chip which is pressed with its contact lands onto the contact areas of the corresponding film circuit for test purposes. It has been determined by tests that the surprisingly simple solution provides for adequate contact from direct current up into the gigahertz range.