| 摘要 |
PURPOSE:To prevent the generation of flaws due to ironing and the adhesion of a plate layer and to perform a molding processing on a lead by a method wherein a pair of roller side plates, which are moved by the guiding of a knockout, and a pair of molding plates, with which an external lead is pushed to the inside by surface-contacting with the external lead and by rotating at an angle of 90 deg. following the movement of the roller side plates, are provided. CONSTITUTION:The external leads 7a and 7a of a semiconductor device 7 are protruded to the left and the right sides, the semiconductor device 7 is pinched by a knockout 1 and a bending die 8, roller side plates 2 are lowered along the vertical surface of the knockout 1, a molding plate 6 is rotated at an angle of 90 deg. in the state wherein the molding plate 5 is surface-contacted to the external lead 7a by the rotation of a roller 6, the external lead 7a is pushed toward inside and molded by bending. As a result, flaws are not generated as the surface of the lead is, not subjected to ironing plating is not adhered to a bending roller, and the molding processing of the lead can be performed efficiently.
|
