| 摘要 |
PURPOSE:To prevent the plating on outer leads from peeling off due to additional friction and sticking on bending rollers by a method wherein outer sides of bending rollers and a knockout are circumscribed with auxiliary rolls so that the bending rollers may be rolled on the outer leads to bend the outer leads of a semiconductor device. CONSTITUTION:As bending rollers 16 are circumscribed with auxiliary rollers 15 which are brought into contact with a knockout 11, when holders 13 fall down, the auxiliary rollers 15 are rolled on by the friction with the knockout 11 to roll the bending rollers 16 on outer leads 17 surely without slipping at all even if the holders 13 fall down or rise up very rapidly. Through these procedures, the plating on outer leads 17 is not sticked on the surface of bending rollers 16 while the clearance between the bending rollers 16 and a bending die 19 is subjected to no change to bend the outer leads 17 so that the friction when the bending rollers 16 fall down along the sides of bending die 19 may not be increased to prevent the plating on outer leads 17 from being peeled off.
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