发明名称 CUTTING METHOD BY LASER BEAM FOR LAMINAR RAW MATERIAL
摘要 PURPOSE:To omit the finishing operation by the manual operation in the titled cutting method by positioning the starting point of the cutting at a waste part deviated from an annular cutting line and avoiding the overlapping of the starting point with the end point with one point of the cutting line as the end point of the cutting and reducing a locus of the surface to be the surface at the time of using at the end point. CONSTITUTION:The proper place of laminar raw material 20 made of resin is cut by a laser beam projected from an irradiating gun 22 to form an opening part. At that time, the surface to be the rear at the time of using the raw material 20 after being worked is made to the top and supported on a supporting device 21. Afterward, the proper place of the part which is deviated from the annular cutting line 25A and to be wasted after the cutting is made to the starting point 23 and projected by the laser beam and passed through. Next, one side at least of the irradiating gun 22 and raw material 10 is moved and a bending point 24 of the annular cutting line 25A and is attained and afterward, is cut along the cutting line 25A to form the locus 25 by the cutting. Moreover, up to the bending point 24 which is not overlapped with the starting point 23 of the locus is cut to form the opening part with a prescribed shape.
申请公布号 JPS62296985(A) 申请公布日期 1987.12.24
申请号 JP19860105457 申请日期 1986.05.08
申请人 SANYO ELECTRIC CO LTD 发明人 WAKUMIZU TERUYOSHI;ARAKI TAKASHI
分类号 B23K26/00;B23K26/40 主分类号 B23K26/00
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