| 摘要 |
PURPOSE:To easily measure the pressure sensitivity characteristic of a semiconductor pressure sensor by positioning chips formed on a semiconductor wafer at the suction holes on a stage using marks, and evacuating in a vacuum the cavity in the stage for a semiconductor wafer prober. CONSTITUTION:When measuring, for example, the pressure sensitivity of a semiconductor pressure sensor, a silicon wafer 2 formed with a circuit and a diaphragm 3 is placed on a stage surface 1a. A circuit formed on the wafer 2 is positioned at marks 7 to position the diaphragm 3 at holes 4 on the state placed corresponding to the diaphragm 3. Then, the rear surface of the diaphragm 3 is evacuated in a vacuum from an inserting port 6 through the cavity 5 to apply a pressure to the surface of the diaphragm 5. Thus, the pressure sensitivity characteristic of the sensor can be readily measured.
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