| 摘要 |
PURPOSE:To eliminate the defective appearance of metal regions and also, to perform selectively connection of lead wires by a method whrein one metal region of the first and second metal regions is covered with photosensitive resin, for example, and after this is heat-treated, a dry etching is perfomed to remove the metal regions by the desired amount. CONSTITUTION:A photosensitive resin 4 is formed on a semiconductor element substrate 1 and ultraviolet irradiation and developing are performed to form the desired pattern. After the pattern is formed, the surface of a second metal region 3 is etched away by dry etching (with mixed gas of CCL4:BCL3:CF4). Thereby, the configuration of the appearance is improved and the metal regions can be removed at the desired amount, with good reproducibility and uniformly. |
