Wafer processing chuck using multiple thin clamps.

摘要

A transport device is used to move a wafer into a processing chamber. Lifting pins receive the wafer and lower the wafer to the surface of the chuck. A multiplicity of thin clamping hooks swing over the edge of the wafer, centering the wafer and then clamp down on the edge of the wafer to hold the wafer firmly to the chuck. Grooves on the face of the chuck and internal channels in the chuck supply helium for thermal contact to the back of the wafer.