| 摘要 |
<p>PURPOSE:To utilize a semiconductor wafer remarkably effectively, by using the same conventional manufacturing method, and forming semiconductor devices on both surfaces of the semiconductor wafer. CONSTITUTION:Semiconductor devices 12 are formed by using the same conventional method on both parallel surfaces of a semiconductor wafer 11. The wafer 11 is cut and divided into an upper part and a lower part in parallel with the surfaces of the wafer in the direction of a line B-B. Then the two conventional semiconductor devices are formed. Thus the wafer 11 can be utilized effectively.</p> |
