| 摘要 |
A solder transfer method which uses an electrically-conductive, e.g., metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve to a solder joint to be made. In on of the preferred embodiments, a solder deposit previously formed on a surface mount pad during a first reflow step will transfer up to the adjoining contact surfaces by a wicking process to provide the additional solder needed to fabricate a robust solder joint. The method and construction are useful for attaching a daughter board to motherboard, and for surface mounting a long header with multiple pins to the contact surfaces of a PCB without the need to separately add solder during a second reflow step to make a robust solder joint between the contact surfaces.
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