| 摘要 |
PURPOSE:To enable a high-reliability bonding pad to be formed in a few manufacture processes, by making the pad extended from the terminal parts of an electronic element to the surface of an insulating substrate, with a Cr thin film and an Al thin film being piled thereon in order. CONSTITUTION:A bonding pad for drawing out terminals of an electronic element, on which flexible print tapes 4 comprising conductive adhesive layers 5 are electrically and mechanically bonded by a thermal pressing method, is made to be extended from the terminal parts of the electronic element to the surface of an insulating substrate 6, with a Cr thin film 2 and an Al thin film 3 being piled thereon in order. For example, on an a-Si photosensitive material pattern 1 formed on the insulating material 6, the Cr thin film 2 is formed and successively the Al thin film 3 is formed thereon. The Al thin film 3 and Cr thin film 2 on the fixed part of the a-Si photosensitive material pattern 1 are then removed by photo-lithoetching, to form a photosensitive element part and besides the pattern of the bonding pad part. On this bonding pad, the flexible print tapes 4 comprising the conductive adhesive layers 5 are then bonded by a thermal pressing method.
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