| 摘要 |
PURPOSE:To improve the applicability of a scanning type electronic microscope and realize quick and highly accurate analysis of the defect of a semiconductor product by a method wherein the whole image of a wafer or a pellet is memorized beforehand and the position of the defective part on the wafer or the pellet is displayed on the whole image. CONSTITUTION:A means 3 which memorizes an observed image, the position of a sample stage and a multiplification factor at an arbitrary time, a means 4 which calculates the relative position of the image under observation in a wider image region containing the observed image by using the respective data obtained from the means 3 and a means 5 which displays the relative position obtained by the means 4 are attached to a scanning type electronic microscope. For instance, the memory device 3 memorizes the image, the multiplification factor and the sample stage position instructed by a terminal device 2. When the display of the position of the defective part under observation is instructed by the terminal device 2, the calculator 4 calculates the relative position of the defective part on the whole image by using the multiplification factor and the position of the sample stage at the time of observation and the multiplification factor and the position of the sample stage memorized by the memory device 3 and the relative position of the defective part is displayed on the whole image displayed on the CRT display 5. |
