| 摘要 |
PURPOSE:To complete the connection of a plastic lead chip carrier by providing leads bent in J shape outside from the peripheral edge of a molding resin, and disposing the downward bent part of the lead out of the plane profile of the resin. CONSTITUTION:In a led chip carrier (PLCC) by plastic molding, the lead is disposed along the peripheral edge of a molding resin 1, and the lower bend part of the lead is disposed outside the plane profile of the resin without bending the end inside in a J shape. That is, the contact part l at the end of the lead 2 bent in J shape is disposed outside the plane profile line AA' of the resin 1. Accordingly, an infrared ray from above is sufficiently received by the contact part, and the reflow of the resin is completed. Thus, the infrared ray is sufficiently emitted to completely connect the lead. |
