Mechanical means and methods for delivery of solder preforms arranged in generally rectilinear patterns and oriented so that the ends of the solder preforms may join two planar surfaces upon the application of heat are disclosed. Several embodiments facilitate the delivery of solder preforms in the forms of posts, clips and rings.
申请公布号
US4712721(A)
申请公布日期
1987.12.15
申请号
US19860840624
申请日期
1986.03.17
申请人
RAYCHEM CORP.
发明人
NOEL, RAYMOND;ROBINSON, WILLIAM M.;CHERIAN, GABE;CLIFFORD, THOMAS H.;CARLOMAGNO, WILLIAM D.;DEASY, WILLIAM M.;GRASSAUER, WILLIE K.;HAYGOOD, DAVID K.;SHERLOCK, H. PAUL;WHITE, HARRY E.
