| 摘要 |
PURPOSE:To obtain a small-sized full automatic plating treatment equipment by mounting a magazine housing a large number of semiconductor packages, which are aligned and brought to an adhesive state, a cathode bar, which is positioned in a plating tank and connects a frame to an external power supply when the magazine is placed, an anode bar on a tank bottom and a vertical shielding layer along the side wall of the magazine. CONSTITUTION:A magazine 3, a side wall 13 of which consists of an insulator, is arranged in a tank 2 filled with a plating solution 1, and a large number of frames 11 are housed while sealing bodies 12 are brought into contact. Sections except sections 5 brought into contact with the frames 11 in semiconductors 10 are insulated and coated 6 in cathode bars 4, and two cathode bars 4 are mounted in parallel. A soluble anode 7 is disposed faced oppositely to the magazine 3 on the bottom of the tank 2, and connected to an external power supply. Vertical shielding plates 8, 9 consisting of an insulator having the same size as a frame housing section are fitted to the upper and lower sections of the magazine, and the upper shielding plate 8 takes half size up to the surface of the plating solution from the upper end of the magazine. According to the constitution, plating treatment can be executed at magazine unit, and the frames can be taken in and out freely from the magazine, thus resulting in miniaturization, then equalizing plating-film thickness by a shielding wall. |
