| 摘要 |
PURPOSE:To obtain excellent plating adhesion without etching by coating a composition consisting of a specified compd. and a solvent on the surface of a substrate, and then plating a metal by electroless plating. CONSTITUTION:The composition consisting of a Pd chelate compd. with Pd as the central atom and acetylacetone, etc., as the ligand, a polymerizable compd. such as vinyl resin, especially a vinyl chloride adhesive, and a solvent such as acetone is coated on the surface of the substrate and dried. An activating liq. is then used for reducing the Pd chelate compd. to form active metallic Pd, and a metal is plated by electroless plating. Besides, an additive such as NaC7H5O3 and nicotinamide is preferably added to the composition. Only the desired surface of the substrate can be electroless-platd by such a method, and mass production can be advantageously realized. Moreover, the method is especially useful for electromagnetic wave shielding and can be applied to printed wiring. |
