Nickel particle plating system

摘要

A nickel particle plating system in which a multiplicity of minute nickel particles are provided with gold and silver coatings and are deposited in a nonconductive matrix to form an electro-conductive body in which the particles may be placed along conductive paths. The coatings are applied to the particles in a unique manner which enables the realization of a gold coating having a maximum thickness of about 5 percent of the maximum particle dimension and a silver coating having a maximum thickness of about 10 percent of the maximum particle dimension.