This invention relates to interconnection circuit boards and processes for making and modifying interconnection circuit boards wherein adhesive is applied to a wire used in scribing a conductor pattern. The adhesive is activated to a tacky state during the wire scribing operation which forms the conductor pattern, and can thereafter be cured to permanently bond the conductors to the board surface.
申请公布号
US4711026(A)
申请公布日期
1987.12.08
申请号
US19850756722
申请日期
1985.07.19
申请人
KOLLMORGEN TECHNOLOGIES CORPORATION
发明人
SWIGGETT, BRIAN E.;MORINO, RONALD;KEOGH, RAYMOND J.;CROWELL, JONATHAN C.;CZENCZY, GEORGE;SCHOENBERG, ANDREW J.;FRIEDRICH, MARJU L.