| 摘要 |
PURPOSE:To prevent the short circuits of neighboring leads and to make it possible to narrow the pitch of the leads, by providing a structure, in which the width of the outer lead bonding part of each lead is made narrow. CONSTITUTION:Only the width of each lead at an outer lead bonding part 10b, which is a lead part and bonded to each bonding pad on a printed board and the like, is made narrow on a film carrier tape 6b. Said tape and a semiconductor element are prepared. Then leads 4b of the film carrier tape and metallic protrusions, which are provided on the electrode terminals of the semiconductor element undergo inner lead bonding. Thereafter, a contactor is contacted to each pad 5b on the film carrier tape, and electric selection and bias testing are performed. The leads are cut in the desired length. Then the outer lead bonding parts 10b of the leads undergoes outer lead bonding to the bonding pads on, e.g., the printed board, and the device is completed.
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