| 摘要 |
PURPOSE:To ensure the ultrasonic bonding between a lead and a wire by making the lead of an electronic component prolonged at the inside/outside of a package prolonged in the package thicker than the other part. CONSTITUTION:An optoelectronic device for optical communication applies optical communication by lighting a laser light from a laser diode chip 15 and sending the laser light through an optical fiber calbe to a desired position. The part of the lead 6 prolonged in the inside of a main body 7 in the lead 6 prolonged at the inside/outside of the package main body 7 of the device is formed as a thick lead 22 whose diameter is, e.g., 0.75mmphi, and the part projected from the package is formed as a thin lead 23 whose diameter is, e.g., 0.45mmphi. One end of the part 22 is fixed by welding at the ehad 24 of the part 23 whose diameter is 0.75mmphi. A wire 20 connected to a pedestal 36 is connected to the lead 6 by ultrasonic wave wire bonding and since the part 22 is formed thick, the lead 6 is not vibrated even when the wire 20 is connected and sure bonding is applied. |
