SEMICONDUCTOR DEVICE

摘要

PURPOSE:To eliminate the directivity control of a package base of CERDIP type semiconductor device by a method wherein a package cap only is provided with an index mark. CONSTITUTION:Within a ceramic dual inline package (CERDIP) type semiconductor device 1, the directivity of a package 2 in a CERDIP type semiconductor device need not be taken into consideration in case of assembling the semiconductor device to be manufactured by means of providing a package cap 8 only with an index mark 8a. Through these procedures, the manufacturing efficiency of CERDIP type semiconductor device 1 can be added.