| 摘要 |
PURPOSE:To improve the quality of a wafer by avoiding the damage of the wafer and chipping by supporting the wafer at three points with inverse truncated pyramid shape grooves provided on each of three quartz rods. CONSTITUTION:Inverse truncated pyramid shape grooves 11a...... 12a......, 13a...... are provided on each of the first-the third quartz rods 11-13 and the three points of the end of a wafer (e.g., 4'' PHI) 20 are supported by using these grooves, e.g., 11a, 12a, 13a. This can prevent damaging the surface of the wafer 20 or chipping when the wafer 20 is taken out of a boat. Yet, the shapes of the grooves on the first-the third quartz rods 11-13 may be another inverse truncated pyramid shape.
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