| 摘要 |
PURPOSE:To simply and rapidly control the concn. of copper by introducing a fixed quantity of a copper plating soln. contg. copper at the desired concn. into a flow cell fitted with a copper ion electrode with a constant-rate pump and by measuring the concn. of the copper ions with an ion meter. CONSTITUTION:Pure water is poured into a beaker 4 by 1l, a copper plating soln. 1 having 60g/l concn. of copper is also poured into the beaker 4 by 1ml with a constant-rate pump 3 and they are uniformly mixed. The resulting soln. is introduced into a flow cell 5 with a peristal pump 8 and the concn. of the copper ions is measured with a copper ion electrode 6. The measured concn. is 58mg/l. Copper plating is carried out with the copper plating soln. 1. After the lapse of 1 day, the soln. 1 is poured again into the beaker 4 by 1ml with the pump 3 and the concn. of the copper ions is measured with the electrode 6. The measured concn. is 46mg/l, so copper sulfate is added to the copper plating soln. 1 by a calculated amount.
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