| 摘要 |
PURPOSE:To obtain an electronic circuit device, in which high density packaging can be accomplished, by providing a cooling means so as to face electronic parts for a plurality of substrates, providing a power supply means so as to face the opposite surface of said cooling means, and connecting a plurality of the substrates by way of flexible interconnecting substrates. CONSTITUTION:The tip parts of many pins 4, which are provided on a power source board 2, are connected to an LSI through a back surface 16 of a module substrate 1 facing said tip parts. Currents are supplied to the LSI from the power source board 2. The LSI is provided on an opposite surface 1a with respect to the power source board 2. A cooling means 3 is provided so as to face the LSI. Therefore, the LSI can be effectively cooled. The neighboring module substrates 1 are connected through a plurality of pins 5, which are provided on the peripheral parts of the substrates, and a flexible substrate 6. Therefore, the substrates can be connected through the short interconnections without crossing the power supply paths between the power source board 2 and the module substrates 1. Thus the high density packaging can be implemented. |
