发明名称 COMPRESSION BONDED TYPE SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent defective airtightness with the generation of cracks by fixing a cylindrical metal to a radiating electrode and using an annular flange for mutually fastening insulating members. CONSTITUTION:A cylindrical metal 3 fast stuck to the side surface of a semiconductor substrate 1 is fixed to a radiating electrode 2, thus forming a base assembly B. A top assembly A is shaped by a compression bonded electrode 4 arranged adjacent to the substrate 1, a spring member 7 constituted of a washer 5 and springs 6, an insulating section 9 placed on an annular stepped section 8 formed to the electrode 4, an insulating member 10 and an annular flange 11. The annular stepped section is shaped to the electrode 4, and a columnar section 12 is formed at the central section of the electrode 4. Accordingly, defective airtight-ness with the generation of cracks is prevented.
申请公布号 JPS62271440(A) 申请公布日期 1987.11.25
申请号 JP19860113697 申请日期 1986.05.20
申请人 TOSHIBA CORP 发明人 ARAKI YOICHI
分类号 H01L21/52;H01L29/74 主分类号 H01L21/52
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