| 摘要 |
PURPOSE:To prevent gas pockets from occurring caused by air mixed in sealing resin, by forming a cull, a runner, gates, and a cavity part in the boundary of iron molds disposed facing to each other and then forming a resin reservoir continued by the gates disposed facing to the cavity part in the piled iron molds. CONSTITUTION:A cavity part 5 for housing semiconductor elements therein, a cull 3, a runner 4, gates 17 and 20 are formed in the boundary of paired molds facing to each other. Mold bases 7 and 7 fitting in these molds and having a heating source buried, ejector pins 10, an ejector plate 11 for clamping these pins, a pot 8 and plunger 13 for housing sealing resin 14 are formed there. The boundary of paired molds 1 and 1 facing to each other runs in the horizontal direction, being provided with a pair of center blocks 2 on its central part. The cull 3, the runner 4, and the cavity 5 are formed along the division plane. A sealed semiconductor device is housed in the cavity 5, and the center block 2 is equipped with a perforated hole 6 in its central part, capable of being connected with the cull 3 positioned directly below it. Hence, air is prevented from staying there, and therefore voids are prevented from occurring in the sealing resin.
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