| 摘要 |
PURPOSE:To enable a good soldering without causing a bent on a substrate by pressing the back face of the substrate using a backup head at the lead pressing time of the electronic component of a heating chip. CONSTITUTION:The substrate 13 tacking a flat package IC main body is held by pinching to the transfer guide. The soldering device of the substrate 13 is pinched by a heating chip 7 and backup head 11 by descending a heating head 6 and ascending a backup head holder 8 with a cylinder 10 on the other hand. With passing a current to the heating chip 7 in this state the solder is solidified with its cooling by the air jetted from a nozzle after melting the solder with the high temp. heating of the lead of the flat package IC. The heating head 6 is thereafter ascended, the holder 8 is simultaneously descended by the cylinder 10 and the heating chip 7 and backup head 11 are simultaneously separated. Consequently the soldering is performed without holding the plane state of the substrate 13 and an incomplete soldering becomes nil.
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