发明名称 |
METHOD FOR PLATING PLASTIC PRODUCT |
摘要 |
PURPOSE:To form a plated layer which is uniform and excellent in adhesion properties by electrostatically coating resin contg. electrically-conductive fine powder to the inside of a metallic mold and molding a plastic product having an electrically-conductive film on the surface and performing electroplating on this film. CONSTITUTION:A masking material 4 is stuck to the unnecessary part of a fixed metallic mold 3a and powdery thermosetting resin or thermoplastic resin composition contg. 70-95wt% electrically-conductive fine powder is coated on the surface of the fixed metallic mold 3a by an electrostatic coater 5. Then the masking material 4 is taken off and a movable metallic mold is placed on the fixed metallic mold 3 and the molds are closed and melted plastic material is filled in the gaps in the molds through a charging hole 3b' and molded. An electrically-conductive film 2 is anchored and closely stuck on the surface of a plastic molded article 1 together with this molding. Required electroplating is performed directly on the film 2. By this method, the plastic product having the plated layer uniform and excellent in adhesion properties is obtained.
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申请公布号 |
JPS62260093(A) |
申请公布日期 |
1987.11.12 |
申请号 |
JP19860104438 |
申请日期 |
1986.05.07 |
申请人 |
DAINIPPON TORYO CO LTD;TOKAI KOGYO KK |
发明人 |
NAGASHIMA YOSHIHISA;SAKAKIBARA TAKAO;ITO TOSHIKAZU |
分类号 |
C25D5/56 |
主分类号 |
C25D5/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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