| 摘要 |
PURPOSE:To obtain a sufficiently thin semiconductor device, which is manufactured easily, and cost of which is reduced, by a method wherein an external electrode terminal is formed in a first region in a thin flexible insulating film, a semiconductor element is arranged in a second region, a section between these regions is connected by an electrical wiring and the second region is sealed with a resin under the state in which the second region is folded on to the first region. CONSTITUTION:An external electrode 6b is shaped onto the first surface of a flexible insulating first film 6a-1, and a semiconductor element 1 is joined with a second surface. A flexible insulating second film 6a-2 holding said semiconductor element 1 between the second film and said first film 6a-1 is formed, and an opening section for wirings for giving an element electrode an electrical connection is shaped to the second film 6a-2. Wirings 6c, 6d connecting said external electrode 6b and the element electrode are shaped so as to be led out of the external electrode 6b, folded back at the end section of the first film 6a-1 and connected to the element electrode through said opening section from the external surface of the second film 6a-2. The semiconductor element 1, the element electrode and the wiring sections 6d in the vicinity of the element electrode are sealed with a sealing resin 5. |
