| 摘要 |
PURPOSE:To prevent a metal film from adhering on the outer peripheral edge of a semiconductor substrate by providing a ring-shaped shielding member the covers a predetermined width from the end of the outer peripheral edge of the substrate along the circumferential direction on a supporting base. CONSTITUTION:A holding base 5 having a reaction tube 2 connected with a high vacuum source 1 and a cathode electrode characteristic regarding a high frequency power source 4 in which an adhering material 3 is mounted in the tube 2, and a supporting base 8 connected with a high frequency power source 7 for supporting a semiconductor substrate 6 are disposed, a plurality of pawls 9, 9,.. for pressing the outer peripheral edge 6a of a semiconductor substrate 6 are provided at the base 8, and a ring-shaped shielding member 10 for covering in a predetermined width from the end along the circumferential direction the outer peripheral edge 6a of the substrate 6 is supported to the pawls 9 in the base 8. When the substrate 6 is set to the base 8 oppositely to the material 3 of the base 5, the edge 6a of the substrate 6 is covered with the shielding member 10. Thus, a metal film of the material 3 is not formed on the edge 6a, the original surface 6b of the substrate is exposed to eliminate problems of raising dust at the time of handling the substrate 6.
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