发明名称 DIE-BONDER
摘要 PURPOSE:To improve reliability of bonding strength and expand applicable range by making the apparatus applicable even if a bonding pad is smaller by a method wherein a remote governing mechanism is provided between a pressing/heating jig and its driving unit so as to facilitate movement with a predetermined imaginary instantaneous center position as the center of movement. CONSTITUTION:If a cross point of downward extended lines of intermediate joints 29a and 29b and the bottom end surface of a pressing/heating jig 30 is predetermined as virtual instantaneous center position O, when the bottom end surface of the pressing/heating jig is inclined by the unevenness of the heights of bonding bumps or the like, at first the right intermediate joint 29a and the left intermediate joint 29b move independently with angles different from each other with respective rotating contrapositions 31 as knots. Then, parallel joints 28a and 28b move with angles different from each other with rotating contrapositions 31 of the respective upper ends as knots so that the inclination of the pressing/heating jig 30 can be absorbed without the displacement of the virtual instantaneous center position O. Therefore, the pressing/heating jig 30 can be inclined following the inclination of a silicon chip without displacement of its virtual instantaneous center position O. With this constitution, the pressure can be applied uniformly so that reliability of bonding strength can be improved.
申请公布号 JPS62256441(A) 申请公布日期 1987.11.09
申请号 JP19860098163 申请日期 1986.04.30
申请人 HITACHI LTD 发明人 TAKAHASHI MICHIRO;ARAI SHINICHI;MITA TORU;SUZUKI TATSUHIRO
分类号 H01L21/52;B23Q1/36;B23Q1/50;H01L21/00 主分类号 H01L21/52
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