| 摘要 |
PURPOSE:To improve the yield and reliability of production of wiring boards by forming an electrically conductive path between conductor parts formed on each substrate with electrically conductive paste, forming electroplated layers on the conductor parts and removing the path in an org. solvent under applied ultrasonic waves. CONSTITUTION:A ceramic substrate 3 is immersed in an alkali degreasing soln. to degrease the tungsten parts 1-1, 1-2 formed by metallization. The substrate 3 is washed and subjected to electroless nickel plating to form nickel layers 2-1. The substrate 3 is further washed and subjected to electroless gold plate to form gold layers 2-2. After the substrate 3 is washed again and dried with a dryer, an electrically conductive path 2-3 is formed between the resulting conductor parts with silver paste. A plating resist layer 2-4 is formed on the path 2-3 and then electroplated gold layers 2-5 are formed. Finally the substrate 3 is immersed in an org. solvent, and ultrasonic waves are applied to remove the path 2-3. |
