| 摘要 |
PURPOSE:To form a bump electrode in a recess shape at a low cost, by providing a hole part at a position, where the bump electrode is to be formed, and growing an Au plated part from the vicinity of the hole part, with an isolated current film being made to remain in the vicinity of the central part of the hole part. CONSTITUTION:A current film 11 is provided on an IC chip 10. Resist 12 is provided on the film 11. A hole part is provided in the current film 11 by photolithography. The hole part is formed so that an isolated current film 11a is made to remain at the central part of the hole part. Then the IC chip is immersed in Au plating liquid, and electric plating is performed. An Au plated part 13 is grown and contacted with the current film 11a, which is isolated at the central part. At this part, the growing of the plating is started. Since the central part is plated later than the other part, an Au plated part 14 having a recess shape at the central part is formed. By removing the resist 12 and the current film 11 other than the electrode part, a bump lelectrode 15 is completed.
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